Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy

The electrochemical corrosion behavior of the Sn-8Zn-3Bi-xCu lead-free solder in 3.5%NaCl solution was studied to reveal effect of Cu addition on the corrosion resistance of Sn-8Zn-3Bi solder alloy. The results showed that adding Cu element increased the corrosion potential of Sn-8Zn-3Bi-xCu solder alloysThe corrosion resistance of Sn-8Zn-3Bi-xCu solder alloys was improved correspondingly. The corrousion product of Sn-8Zn-3Bi-xCu alloy was mainly zinc oxide. More corrosion products were observed with the increse of Cu content.