Stripping method of metal copper foil on waste epoxy circuit board

A method for peeling off metal copper foils from abandoned epoxy circuit boards by using dilute alkali solution containing alcohol adopts reaction solvents compounded by sulfuric acid, alcohol and water in proportion to erode the coarse particles of the epoxy circuit boards under the temperature of 150 DEG C to 250 DEG C. The method is characterized in that in the range of coarser particle diameters, the complete separation between metal and nonmetal of the epoxy circuit board is realized; the dilute vitriol solution containing alcohol does not erode the copper and valuable metals on the circuit boards, and the effect of the dilute alkali solution on resin matrix is dominated by the swelling, the back of the separated metal foil does not have nonmetal conglutination, the metals and the nonmetal both have high recovery value, and the reaction solvent can be used repeatedly.