Shear Properties and Fracture Behaviors of Cu/Sn-37Pb/Cu Solder Interconnections at Cryogenic Temperatures

The shear properties and fracture behavior of the Cu/Sn-37Pb/Cu solder interconnections at temperatures ranging from −196 °C to room temperature were investigated in the present study. With a decrement in the testing temperature, the shear strength of the solder interconnections gradually increased first, but then decreased after it reached a maximum value at −150 °C. The shear strength of Cu/Sn-37Pb/Cu interconnects at cryogenic temperatures (below −55 °C) was much higher than that at room temperature. With a decline in the testing temperature, the fracture position of the solder interconnections transformed from in the solder bulk to partially in the solder bulk and partially in the interfacial IMCs.