The semiconductor device unit with pseudo chip

The present invention provides a semiconductor device package having a structure with dummy chip prepared which a first substrate having formed thereon a chip-receiving through holes; a first die having first bonding pads and a second die having second bonding pads are respectively arranged in the chip-receiving through holes; a hole formed in the gap between the first and second chip and the side walls of the chip holding through-holes of the first substrate adhesive material; Redistribution lines, which are formed for connecting the formed on the first substrate contact pads with the first bonding pads or the second bonding pads; and a protective layer which is formed on the redistribution lines, the first chip, the second chip and the first substrate comprises.