Improvement of window profile and metal step coverage for submicron CMOS devices
1991
Presents the work the authors have done to continuously improve an existing reliable window process. They demonstrate a technique which opens a window by blanket plasma reactive ion etch (RIE). Very smooth window profile is obtained and aluminum step coverage in the window is improved. >
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
2
References
0
Citations
NaN
KQI