Mechanical Properties of Plasma‐Polymerized Tetravinylsilane Films

Continuous stiffness measurement (CSM) and dynamic contact module (DCM) nanoindentation measurements were used to characterize the mechanical properties of plasma-polymerized tetravinylsilane films deposited by PECVD at RF powers ranging from 10 to 70 W. The Young's modulus and hardness as a function of the indenter displacement (5-500 nm) were investigated for films of 1-μm thickness. The Young's modulus (hardness) was observed to increase from 8.3 (0.9 GPa) to 58 GPa (9.5 GPa) with enhanced RF power. Nanoindentation analysis together with AFM imaging revealed a grain character of films deposited at a higher power. Finite element analysis was used to simulate nanoindentation measurements and evaluate properties of the elastic―plastic material.