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Analytical and finite element study on warpage and stress of 2.5D chip-package structures
Analytical and finite element study on warpage and stress of 2.5D chip-package structures
2021
Sida Hao
Weishen Chu
Paul S. Ho
Joonsik Sohn Lee
Rui Huang
Keywords:
Chip
Materials science
finite element study
Structural engineering
Stress (mechanics)
Correction
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