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Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation Substrates
Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation Substrates
2019
Christian Wendeln
Edith Steinhäuser
Lutz Stamp
Bexy Dosse-Gomez
Elisa Langhammer
Sebastian Reiber
Sebastian Dunnebeil
Sandra Röseler
Roger Massey
Keywords:
Materials science
Nuclear chemistry
Formaldehyde
Copper
Correction
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