Laser deposition manufacturing of bimetallic structure from TA15 to inconel 718 via copper interlayer

Abstract Manufacturing of bimetallic structure from titanium (Ti-) to nickel (Ni-) based alloys has a specific interest in reducing the structure weight and making full use of individual excellent properties of the two kind metals. However, due to large differences in physical and chemical properties between the two metals, the laser deposition manufacturing (LDM) of Ti-/Ni-based alloys cannot avoid the cracking and brittle failure at the bond zone. In this work, the low-cost copper (Cu) was used as the bond layers for LDM of two model alloys TA15 and inconel 718 (IN718). Results showed that the Cu interlayer was very useful to eliminate the cracking and obtain a plastic transit between TA15 and IN718. Metallurgical bonds can also be achieved at the interfaces of the two alloys.