Preparation and Properties of Cu-PPO Conductive Adhesive Filled with Copper Nanoparticle

In this paper, a conductive paste is prepared by using copper powder of different sizes between 50 nm and 10 μm. The effects of copper powder particle size, nano copper powder addition, mass ratio of polyphenylene ether to tetrahydrofuran and different surface modification methods on the electrical resistivity and flexural strength of conductive adhesives were investigated. The microstructure of the composites was investigated by scanning electron microscopy (SEM). The results show that by controlling the ratio of copper powder to polyphenylene ether, conductive adhesives with different resistivity and bending strength can be obtained. When the mass ratio of copper powder to tetrahydrofuran solution is 1∶6, the mass ratio of polyphenylene ether to tetrahydrofuran is 1∶8.9, and the curing time is 4 h at 40 °C, the preparation time is the shortest and the material performance is better.