Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load

Electronic packaging solder joints are the key parts of mechanical fixation and electrical interconnection between electronic chips and printed circuit boards, which are prone to failure and lead to electronic device failures under the action of vibration environment stress. In regard to the failure characterization and degradation modeling of electronic packaging solder joints under vibration load, this paper adopts environmental stress tests, builds a vibration failure test platform, designs a vibration load excitation spectrum, and obtains solder joint degradation data under vibration stress; it uses the square root amplitude, form factors, and kurtosis factors to characterize the solder joint degradation process, which effectively identify the solder joint degradation node, and improve the data monotonicity of the solder joint degradation process; the Wiener process is used to build a solder joint multi-stage degradation model. Based on the EM algorithm, the hyperparameters of the degradation model have been optimized, and the universal test of the Wiener degradation model with multiple samples is carried out in accordance with the LB index. The analysis shows that the effectiveness of different samples is as high as 87.5%, which verifies the universality of the Wiener degradation model; Based on the crack morphology subject to the solder joint test and the features of the solder joint in the multi-stages, the paper analyzes the crack propagation behavior of the solder joint, and clarifies the failure mechanism of the solder joint.