Double-side polishing method for a manufacturing method and a wafer carrier for double-side polishing apparatus

A method for manufacturing a carrier for a double-side polishing apparatus and a double-side polishing method for a wafer that can improve the flatness of an edge portion of a wafer after double-side polishing. A carrier base material, a preparation step of preparing an insert material thicker than the carrier base material, and a holding hole for holding the insert material so that the insert material protrudes from both the front side and the back side of the carrier base material. A measuring step for measuring the amount of protrusion on the front side of the carrier base material and the amount of protrusion on the back side of the insert material protruding from the back side of the carrier base material, A setting step for setting the rotation speeds of the upper and lower surface plates when the carrier is raised and polished so that the difference between the protrusion amount and the rear surface side protrusion amount is small; And a rising polishing step for rising and polishing the carrier at each rotation speed. [Selection] Figure 1