Structural and Dielectric Properties of Glass – Ceramic Substrate with Varied Sintering Temperatures

The main requirements of microwave circuit technology for wireless applications are a com‐ bination of high performance circuit, high integration density and frequency stability with a cost effective price [1-2]. Ceramic technology is particularly well suited to these require‐ ments due to the superior performance of their electrical, electromechanical, dielectric and thermal properties in order to satisfy the many complex tradeoffs involved in electronic de‐ vices to meet many of today’s and future needs [3]. However, as the demand for revolution‐ ary changes in mobile phone and other communication systems using microwave as a carrier is increasing, the usage of ceramics may have reached at a certain limit. Thus, contin‐ uous research on this ceramic technology is urgently required in order to get an advanced improvement and innovation in the material properties in conjunction with the rapid change of required device characteristics. Although we may sometimes experience misera‐ ble insufficiency of accumulated knowledge in regard to basic research, it is believed that these research activities can contribute immeasurably to give scientific and technological un‐ derstanding which is very important especially for the new engineer and researcher.