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Analysis of Electromigration-Induced Evolution of Void Morphology in Unpassivated Thin-Film Interconnects
Analysis of Electromigration-Induced Evolution of Void Morphology in Unpassivated Thin-Film Interconnects
1998
M. Rauf Gungor
Henry S. Ho
Dimitrios Maroudas
Keywords:
Morphology (linguistics)
Thin film
Materials science
Void (astronomy)
Electromigration
Composite material
Correction
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