Analysis and Research on Random Vibration Characteristics of Microchannel-Containing LTCC Microwave Module

In this paper, the microchannel-containing low temperature co-fired ceramics (LTCC) microwave module model was designed, its modal and random vibration were analyzed using the ANSYS finite element analysis software, and the intrinsic frequency and stress nephogram of model were obtained. It can be seen that the maximum first-order modal displacement of LTCC microwave module occurred in the middle of substrate, and the stress was distributed uniformly under random vibration excitation. The maximum stress was mainly at a fixed position of four corners. Then the LTCC microwave module model with or without microchannel was analyzed. The results showed that the maximum vibration stress of microchannel-containing LTCC microwave module was smaller. With the length, width and height of the full-sized microchannel as the factors, the three-level orthogonal tests were performed, and the degree of influence of full-sized microchannel on random vibration characteristics is as follows: width>length>height.