Copper powder and electrically conductive paste, electrically conductive coating, electrically conductive sheet, and antistatic coating using same

To provide a copper powder exhibiting a high electric conductivity suitable for a metallic filler used in an electrically conductive paste, a resin for electromagnetic shielding, an antistatic coating, etc., and having excellent uniform dispersibility required for forming a paste so as to inhibit an increase in viscosity due to flocculation. This copper powder 1 forms a branch shape having a plurality of branches through the conglomeration of copper particles 2. The copper particles 2 have a spheroidal shape, with diameters ranging from 0.2 µm-0.5 µm, inclusive, and lengths ranging from 0.5 µm-2.0 µm, inclusive. The average particle diameter (D50) of the copper powder 1 in which the spheroidal copper particles 2 have conglomerated is 5.0 µm-20 µm. By mixing this tree-branch-shaped copper powder 1 into a resin, it is possible to produce an electrically conductive paste, etc., exhibiting excellent electric conductivity, for example.