Environmental-protection low halogen-content surface mounting adhesive capable of quick solidification under low temperature

2008 
The invention discloses an environmental-protection low halogen-content (the total halogen content is smaller than 450ppm) surface mounting adhesive capable of quick solidification under low temperature. The adhesive is composed of high-purity liquid epoxy resin, modified epoxy resin, high-purity active diluent, a halogen-free latent firming agent, an accelerating agent, a thixotropic agent, an ion absorbing agent, high-purity inorganic padding and pigment. The weight percent of the above components is as follows: the high-purity liquid epoxy resin: 20 to 80%; the modified epoxy resin 0 to 10%; the high-purity active diluent: 1 to 10%; the halogen-free latent firming agent: 1 to 8%; the accelerating agent: 2 to 20%; the thixotropic agent 3 to 10%; the ion absorbing agent: 0 to 1%; the high-purity inorganic padding: 0 to 30%; and pigment: 0 to 3%. Compared a the present product, the halogen content of the adhesive is low, the total halogen content is smaller than 450ppm, the thixotropy is good, and the electric performance is excellent. The adhesive can be quickly solidified in 40 to 50 seconds under the temperature of 100 DEG C. With high adhesion power and good heat/impact resisting performance, the adhesive can be widely used in the technical field of surface mounting with strict requirement for environmental protection.
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