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A Micro-channel Cooling Model For a Three-dimensional Integrated Circuit Considering Through-silicon Vias
A Micro-channel Cooling Model For a Three-dimensional Integrated Circuit Considering Through-silicon Vias
2020
Kang-Jia Wang
Hong Chang-Sun
Kui-Zhi Wang
Keywords:
Materials science
Optoelectronics
Nanotechnology
Three-dimensional integrated circuit
Communication channel
Silicon
Correction
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