Stacked via structure for metal backup applications

A Back-End-Of-The-Line (BEOL) -Sicherungsstruktur having a stack of vias (122, 132). The stacking of vias (122, 132) results in high aspect ratios, which makes Uberzugsschicht- and seed coverage worse inside of the vias. The weak points of the coating layer (124) and the seed layers leads fails over to a higher probability for an electromigration (EM). The fuse structure is failure to due to poor Uberzugsschicht- and seed coverage. Design features allow a determination of whether failures occur, a determination of the extent of the damaged area after programming of the fuse and prevent further spread of the damaged dielectric region.