Impact of package on neutron induced single event upset in 20 nm SRAM

This work investigates the impact of package structure on single event upset (SEU) rate through neutron irradiation test and Monte Carlo simulation of the particles passage. Irradiation test results show that the resin existing in the upper stream of the beam could increase SEU rate by about 10 %. The simulation result demonstrates that light secondary particles generated in the package materials, such as proton and alpha particles, contribute to the SEU rate elevation. Therefore, SEU rate evaluation should pay attention to the package structure especially for low voltage devices having low critical charge of 0.4 fC and below.