A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

Mitsuru Fujita,Nobuhiro Anzai,Kazutoshi Sakamaki,Yoshiharu Kariya

A finite element analysis of board level drop reliability test and analysis of stress buffer effect of polyimide

2013

Mitsuru Fujita
Nobuhiro Anzai
Kazutoshi Sakamaki
Yoshiharu Kariya

Buffer function of polyimide layer by drop test is discussed. The drop impact was calculated with a finite element analysis. It was found the factors of polyimide thickness and modulus have contributions to stress responses.

Keywords:

Electronic engineering
Engineering
Drop impact
Drop test
Polyimide
Finite element method
Conductive polymer
Engineering drawing
Modulus
Optics
stress effects
Composite material

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