Wafer-to-wafer bonding structure

The technical features of the invention it is possible to maintain a certain level of adhesion even without the dummy pattern, and provides a wafer to wafer bonding structure capable of preventing a defect due to a gap or voids after bonding. The wafer to wafer bonded structure is being formed through a first insulating layer, the first insulating layer on the first substrate and the protruding portion on the upper surface of the first insulating layer if by a first barrier metal layer and the side surface is surrounded by the 1, a first wafer having a copper pad; The second being formed through the second insulating layer, the second insulating layer on the substrate and the projecting part on the upper surface of the second insulating layer and if by the second barrier metal layer and the side surround, the first copper pad a second wafer having a second pad of the copper bond; And a polymeric layer disposed between the first barrier metal layer and a surrounding the exposed side of the second barrier metal layer, the first wafer and second wafer; and a.