Pressure module, pressure device, the substrate bonding device, the substrate bonding method and a bonded substrate

When joining the substrates by the application of pressure, the pressure uniformity in the substrate plane becomes a problem. A pressure variable unit for a stage having a placement surface on which the pressure member is mounted, the pressure distribution in the surface of the mounting surface in a variable, a plurality of pressure detection unit for detecting the pressure of said pressure variable unit pressurized module is provided with and. It said pressure variable unit, based on the detected pressure by the plurality of pressure detection portion may further include a control unit for changing the pressure distribution in a plane of the mounting surface.