Multi-chip semiconductor structure and forming method thereof

PROBLEM TO BE SOLVED: To provide a structure which can be rewired even through chips are finally connected therebetween by electrically connecting a fuse in series to at least one wire drawn out of at least one semiconductor device chip in a stack. SOLUTION: Each drawn wire is positioned on an end surface of a stack, and electrically connected to each connect assembly 22. Each connect assembly 22 comprises a contact pad 26 further electrically connected through a T-shaped connect pad 24 and a fuse wire 28. The fuse wire 28 and the T shaped contact pad 24 are electrically connected to the corresponding drawn wire 20 through the contact pad 26. Accordingly, burn-in process need not be interrupted, and the semiconductor device chip 14 can be simultaneously subjected to burn-in stress on the long stack and examined using each connect assembly 22, even though one or more chips 14 are short-circuited in the stack.