The method of separation of the diamond layer

The present invention discloses a method for the separation of the diamond layer, the method comprising the steps of: using a laser to treat internal diamond two-dimensional scanning process, a predetermined depth forming a non-diamond layer on the diamond surface to be treated; removing the non-diamond layer, in order to achieve the above-described separation of the vertically diamond. With this method does not damage the substrate surface of the diamond, as compared with laser cutting, diamond cutting loss is reduced in; as compared with the ion implantation separation techniques, cost savings, reducing the processing time.