Manufacturing method of multilayered printed circuit board

A method for manufacturing multilayer Printed Circuit Board(PCB) is provided to form the micro-patterning circuit in the on the outermost layer by burying the outermost layer circuit in the insulation resin. The pattern for the metal layer and the lower layer circuit formation are formed on the carrier successively. The carrier is made of the metal having the coefficient of thermal expansion which is low. The conductive material is charged with the pattern for the lower layer circuit formation. The lower layer circuit(180) is formed. When the carrier is removed, the lower layer circuit becomes the circuit of the outermost layer. The pattern for the lower layer circuit formation is removed. The insulation resin(200) is laminated on the lower layer circuit. A via hole is formed in the insulation resin. The via hole is connected to the lower layer circuit. The inner circuit(260) and the inter layer connector(280) are formed on the insulation resin. Then, a pair of circuit part is formed. The inter layer connector connects the inner circuit to the lower layer circuit. The pair of circuit part is joined by the position matching each other. The carrier and the metal layer are removed.