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3D Sequential Integration via Direct Bonding of Highly Conductive Sputtered Tungsten Films
3D Sequential Integration via Direct Bonding of Highly Conductive Sputtered Tungsten Films
2015
Lamine Benaissa
Paul Gondcharton
Bruno Imbert
C. Sabbione
G. Rodriguez
D. Mariolle
D. Lafond
Keywords:
Tungsten
Direct bonding
Electrical conductor
Materials science
Composite material
Correction
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