Influence of Tm:YAP laser irradiation on tensile strength for bracket debonding
2011
The investigation of tensile strength needed for bracket debonding was the aim of study. A diode pumped Tm: YAP
microchip laser generating a continuous 2um radiation with the maximum output power of 4W was used for debonding
purposes. The group of 60 brackets was debonded using classical and laser irradiation methods - the doze from 1W to 4
W, 60s. The tensile strength without laser irradiation was in the range from 39.6 N (full ceramic bracket group) to 63.7 N
(ceramic bracket with metal slot group). After irradiation the tensile strength was decreased from 35.1 N (full ceramic
bracket group) to 48.8 N (ceramic bracket with metal slot group). The results of our study generally agree with the
previous studies, substantiating the fact that lasers can be used effectively to thermally soften the adhesive resin for
removal of ceramic brackets. From the practical point of view is conclusion that during laser irradiation, thermal
ablation occurs and the bracket is removed from the enamel together with the rest of the adhesive resin. Laser
debonding is easier and little heat diffusion occurred.
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