Spin Coating Film Transfer and Hot-Pressing System for Uniform Dielectric Formation and Its Application to Porous Low-k Film Formation

In this paper, we describe a transfer system that enables to form uniform dielectrics using spin coating film transfer and hot-pressing (STP) technology, and the applicability of a porous low-k material. The STP technology transfers a dielectric from a base film to a wafer by hot pressing in vacuum. We propose a processing unit that enables the handling of both the wafer and the base film. In the transfer unit, we also propose a scheme for transferring a dielectric to wafer uniformly. In the experiments, an organic porous low-k material, porous nanoporous polybenzoxazole dielectric (OxD) is used. The results on the film characteristics show no difference from those obtained by conventional spin coating. STP also enables planarization and sealing for patterned wafers with the porous OxD. It is confirmed that the STP process using porous OxD will be a candidate integration process.