Pad manufacturing method and pad

The invention discloses a pad manufacturing method and a pad and relates to the field of semiconductor process technologies. By using the pad manufacturing method provided by the embodiment of the invention, since a metal layer is deposited on the chip after the passivating layer of the pad area of a chip is etched, then the metal layer outside the pad area is removed through an adhesive thin film and finally the metal layer in the pad area is reserved, the thickness of pad metal is increased.