Establishing Chip Scale Packaging (CSP) Capabilities at the University of Alaska Fairbanks: Lessons Learned in Tech Transfer, R&D and Sustaining

UAF's Office of Electronic Miniaturization (OEM) has successfully transferred technology and established a prototyping chip scale packaging line in Alaska. This was accomplished by carefully managing each operational interface in the academic environment consistent with our mission. Our program offers significant benefits to the University of Alaska system, its academic partners at other universities, governmental agencies that support our activities, the community and its many industrial partners. Chip Scale Packaging is a very successful technology particularly in the consumer electronics sector. It has a proven track record. It has not penetrated as well in high value systems, entrepreneurial technologies, and government sector electronics. Our facility offers an excellent opportunity to apply CSP technologies to many unexplored areas without requiring high volume commitments. OEM is keenly interested in collaborative R&D as well as pilot projects. We welcome inquiries (www.silicontundra.org).