Three-dimensional integration of MEMS

Abstract This chapter elaborates on packaging technologies for micro electro mechanical system (MEMS). Within a basic concept discussion, we focus on cavity formation and on further assembly of the MEMS to produce a surface mountable device. We discuss standard solutions as well as examples for complex three-dimensional heterogeneous integration. Emphasis is also put on the importance of low-stress packaging: package-induced stress has the problem that it can substantially deteriorate the performance of a MEMS device. In consequence, measures to keep the stress level low need to be taken into account.