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Epoxy Molding Compound Filler Clogging Simulation during Integrated Circuit Encapsulation Process
Epoxy Molding Compound Filler Clogging Simulation during Integrated Circuit Encapsulation Process
2021
Bo Heng Chen
Sheng-Jye Hwang
Yu-Yang Chang
Yu-Shuo Yang
Huei-Huang Lee
Bing-Yuan Huang
Ian Hu
Dao Long Chen
David Tarng
Cp Hung
Keywords:
Process (computing)
Molding (process)
Epoxy
Materials science
filler
Composite material
Integrated circuit packaging
Clogging
Correction
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