Chip size packing structure and chip size packaging method

The invention provides a chip size packing structure or a chip size packaging method. The chip size packaging method includes the following steps: grinding a bottom face of a round sheet; arranging a bottom face of a substrate on a carrier; bonding the bottom face of the grinded round sheet to the top face of substrate through a bonding layer; separating the carrier; coupling a plurality of connecting pads of the round sheet to a plurality of external connecting pads of the substrate, wherein the connecting pads are formed on the top face of the round sheet and the external connecting pads are formed on the bottom face of the substrate; and cutting the round sheet to a plurality of chip size packaging structures.