Computer-controlled thermal cycling tool to aid in SiC module package characterization

A software-controlled thermal cycling test system developed for SiC module package characterization is presented. The software interface permits the flexible definition of testing parameters such as variable data acquisition rates, customizable cycle transition's duration, and the independently controlled heating and cooling rates of the test. The cycle's heating is provided by a controlled power supply, while two independent mass flow controllers provide the cycle's cooling control, which can be a combination of air and water flows depending on the test conditions. The interface provides visual feedback by continuously showing the heatplate temperature and the thermal cycling measurements in situ. The system has shown to be a useful tool in a comprehensive package degradation project through the monitoring package and electrical variation due to thermal cycling.