Selective rear side ablation of thin nickel–chromium-alloy films using ultrashort laser pulses

In recent years, the selective laser structuring from the transparent substrate side plays an increased role in thin film processing. The rear side ablation is a highly effective ablation method for thin film structuring and revels a high structuring quality. Therefore, the rear side ablation of nickel–chromium-alloy thin films on glass substrate was investigated using femtosecond laser irradiation. Single and multiple pulses ablation thresholds as well as the incubation coefficient were determined. By irradiation from the transparent substrate side at low fluences a cracking or a partly delamination of the film could be observed. By increasing the fluence the most part of the film was ablated, however, a very thin film remained at the interface of the glass substrate. This thin remaining layer could be completely ablated by two pulses. A further increase of the pulse number had no influence on the ablation morphology. The ablated film was still intact and an entire disc or fragments could be collected near the ablation area. The fragments showed no morphology change and were still in solid state.