Simulation and Study of Ultrasonic Vibration Propagation in Wire Bonding System

The chip package has an important position in chip manufacturing,and wire bonding accounts for 90% of chip package.A wire bonding system is introduced,and calculation theory principle of wire bonding is presented.A model of 63 kHz wire bonding transducer is built utilizing finite element method.The mode around work frequency is calculated.Impedance test and vibration test show that both the work mode and non-work mode are excitated during working,which validates the correctness of finite mode analysis.It is proved that the finite element method is valid in wire bonding system.