Comparison of the efficacy of sulfurization agents in decreasing the sheet resistance of polyamide and polyethylene with copper sulfide layers and influence of their compositions

The process of obtaining semiconductive and electrical conductive layers of copper sulfides by the sorption — diffusion method on polymers (polyamide 6 and low density polyethylene) using solutions of potassium pentathionate, K2S5O6, and higher polythionic acids, H2S n O6 (n = 21, 33), was investigated. The layers were characterized for compositional and electrical properties by X-ray diffraction (XRD) analysis and sheet resistance measurements. The thickness of copper sulfides layers on polyamide and polyethylene increased with increasing time of polymer sulfurization and varied from 10 to 43 µm. The variations of the sheet resistance of copper sulfides layers formed on the surface of polymers on sulfurization agent used, the conditions of sulfurization, chemical and phase composition of the obtained layers were established. Sheet resistance of copper sulfides layers decreases with increasing time of the duration of sulfurization and the number of sulfur atoms in the polythionate anion. The sheet resistance values for copper sulfide layers formed on the polyamide surface are much lower than those of Cu x S formed on the polyethylene surface. XRD showed the predomination of Cu x S phases with low x values.