Cu contact on NiSi/Si with thin Ru/TaN barrier

ZhaoYing,ZhouMi,RuGuo-Ping,JiangYu-Long,QuXin-Ping

Cu contact on NiSi/Si with thin Ru/TaN barrier

2011

ZhaoYing
ZhouMi
RuGuo-Ping
JiangYu-Long
QuXin-Ping

Thin Ru(5nm)/TaN(15nm) bi-layer was sputtered on the NiSi/Si substrate as a diffusion barrier in the copper contact structure. The barrier properties were investigated through X-ray diffraction (XR...

Keywords:

Copper
Diffusion barrier
Substrate (chemistry)
Analytical chemistry
Materials science
Diffraction
si substrate

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