Demonstration of +100 GHz Interconnects in eWLB Packaging Technology

This paper presents waveguide interconnects implemented in Embedded Wafer Level Ball Grid Array (eWLB) packaging technology. The interconnects operate at D-band (110- 170 GHz) hence are enabling the realization and commercialization of high data rate systems. The interconnects rely on implementing radiating structures on the technology’s redistribution layers (RDLs) instead of using conventional Ball Grid Arrays (BGAs) for the transmission of the RF signal to/from the package. The interconnects interface with standard WR-6.5 waveguides. Moreover, they do not require any galvanic contacts with the waveguide. The interconnects achieve a measured insertion loss of 2.8 dB over a bandwidth of 33%. The adopted eWLB packaging technology is suitable for low-cost high-volume production and allows heterogeneous integration with other technologies. This work proposes cost-effective high-performance interconnects for THz integration thus addressing one of the main challenges facing systems operating beyond 100 GHz.