Bonding metal oxide particles, sintering bonding agent comprising the same, method of manufacturing a bonding metal oxide particles, and bonding method of the electronic component

As well as both the bonding property and stability of the particles in the sintering bonding agent using nanoparticles, sintered bonding agent mainly material cuprous oxide nanoparticles capable of suppressing ion migration, a method of manufacturing the same and to provide a bonding method using the same. It includes copper metal, a composite particle balance being cuprous and unavoidable impurities oxidation for bonding metal. The composite particles of copper having a dispersed within the structure of the particles, an average particle size of 1000nm or less.