Water-soluble hot-melt adhesive glue

The present invention relates to the technical field of high molecular polymer emulsion type glue, in particular to a water-soluble hot-melt glue. In the preparation method of the water-soluble hot-melt glue, the water-soluble hot-melt glue contains binder, viscosity increaser, filler, organic silicon defoamer, organic silicon mildew preventive, other assistants and water, and the water-soluble hot-melt glue is characterized in that the components are calculated according to the total weight portion of the non-volatile ingredients which amounts to 100, the dosage proportion of the ingredients is as follows: 10 to 40 portions of binder, 10 to 30 portions of viscosity increaser, 20 to 60 portions of filler, 10ppm to 100000ppm of organic silicon defoamer, 1ppm to 10000ppm of organic silicon mildew preventive, 0.1 to 5 portions of assistants and 100 to 300 portions of water. Compared with the prior art, the water-soluble hot-melt glue fills the domestic gap in the field and is worth promotion and application.