Novel polyamic acid, polyimide and their uses

The present invention provides a polyimide resin that is useful as a circuit material, has high transparency, is excellent in warpage resistance, is soluble in an organic solvent having a low boiling point, and can be imidized at low temperature, and a polyamic acid that is a precursor thereof. A tetracarboxylic dianhydride represented by the following formula (1) as a structural unit: Diamine (I) represented by the following general formula (2): (In the formula, R represents a divalent linking group selected from an alkylene group, an ether group, a thioether group, a carbonyl group, and an imino group, which may be substituted with a C 1 to C 4 halogen atom; A novel polyamic acid characterized by containing 0 or 1 as an essential component. [Selection figure] None