The characteristics of joints with Indium-silver alloy using diffusion soldering method

Bonding process using indium-silver alloy which can withstand high temperature was investigated at relatively low temperature. We used a thermal evaporator and vacuum coater for making indium-silver contact. From the result of experiment, we observed that indium and silver films which have good quality are formed. From phase diagram of In-Ag alloy, we can find that melting point of these compounds increases with the silver content, i.e. eutectic (144° C)

Keywords:

• Alloy
• Metallurgy
• Soldering
• Indium
• Materials science

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