Towards high performance sub-10nm finW bulk FinFET technology

We demonstrate the effectiveness and limitations of critical performance elements in silicon channel bulk finFET CMOS devices featuring embedded Source/Drain (e_SD) dual epi. Further scaling of the fin width below 10nm is shown to impact both the access resistance and S/D overlap capacitances while the mobility behavior for both nMOS and pMOS devices further degrades. Epitaxial S/D regrowth options are optimized to demonstrate ring-oscillator functionality for fin width down to ∼4nm.