Electronic device having a conductive layer and method for making

electronic device and manufacturing method, comprising: a support plate (2) having a mounting face (5), at least one integrated circuit chip (4) mounted on said mounting face of the support plate, a block of encapsulation (6) wherein the chip is embedded, this encapsulation block extending over the chip and around the chip on said mounting face of the supporting plate and having a front face (9), at least one hole (8) passing through said encapsulation block and uncovering at least part of an electrical contact (10), and at least one layer (12) of a conductive material electrically, lying on said front face (9 ) of said encapsulation block and connected to said electrical contact in said hole.