New integration schemes for 2,5D interposer

2,5D interposer are a hot topic at the moment in the packaging world. An interposer allows to inter-chip communication between multiple chips with intra-chip interconnects. This enables unmatched bandwidth, reduced power consumption and very good heat spreading. The 2,5D interposer allows to implement a big part of the promise of 3D ICs without the need to make TSVs into the chips.