Circuit connecting material, connecting structure for circuit parts and connecting method for circuit parts

The invention relates to a circuit connecting material, a connecting structure for circuit parts and a connecting method for circuit parts. The circuit connecting material contains an optical or thermal cured adhesive composite and an organic compound with urethano and ester group and is used for connecting circuit parts provided with base plates and circuit electrodes formed on the main surfacesof the base plates. The weight-average molecular weight of the organic compound is 5,000 to 100,000. When the circuit connecting material and the connecting method of the invention are used for connecting the circuit parts, the connecting structure of the circuit parts which have high adhesion strength and good durability at high temperature and humidity can be obtained.