Field emission in actuation pads of radio frequency microelectromechanical systems ohmic switches: A potential contamination mechanism

The field emission current generated across the actuation pads in ohmic MEMS switches during ON state is shown to constitute an additional source of degradation. Switches with Au/Au and Au/Ru contacts have been subjected to 24 h continuous stress. In both cases the switch ohmic contact resistance and field emission current across actuation pads were monitored simultaneously. The experimental results revealed a negligible degradation in Au/Au contact devices while the Au/Ru contact devices show a fast degradation. The experimental results from Au/Au and Ru/Au contact switches have been compared taking into account the plasma generation in the actuation pads.