Composition for heat-dissipation members, heat-dissipation member, and electronic device

The invention of the present application provides: a composition capable of forming heat-dissipation members having high thermal conductivity; and a heat-dissipation member. The composition for heat-dissipation members includes: a polymerizable liquid crystal compound which has, at both ends, a structure including an oxiranyl group or an oxetanyl group; a curing agent for curing the polymerizable liquid crystal compound; and an inorganic filler formed from a nitride. The curing temperature of the composition for heat-dissipation members is more than or within the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and less than or within the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. A heat-dissipation member formed from this composition is capable of exhibiting excellent thermal conductivity as a result of the synergistic effect of the inorganic filler formed from the nitride and the alignment of the liquid crystal compound.